Convection reflow is the preferred method of SMT reflow soldering of surface mounted components to a PCB. The Convection reflow oven is typically separated into zones in which each zone is independently controlled to optimize the thermal profile of the oven’s process zone. Convection reflow is controllable and highly efficient in terms of transferring heat to a SMT PCB assembly. Multi-level flux filtering of the oven ensures high-activity processing.
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